Low molecular weight polyamide 650
低分子聚酰胺650
Also known as: Polyamide curing agent 650, Epoxy resin curing agent 650, Polyamide resin, low molecular weight 650, Low molecular weight polyamide 650, Polyamide 650
Low molecular weight polyamide 650 (CAS 63428-84-2) is a compound in the Organic Bases category listed in the Jingsj chemical database. It has the molecular formula C23H26N2O4 and a molecular weight of 394.471 g/mol. It is also known as Polyamide curing agent 650, Epoxy resin curing agent 650 and Polyamide resin, low molecular weight 650. No supplier offers are currently listed; request a quote. Record last updated Aug 21, 2026.
- CAS No.
- 63428-84-2
- Jingsj CID
- J-1417585-1
- Molecular Formula
- C23H26N2O4
- Chinese Name
- 低分子聚酰胺650
- Molecular Weight
- 394.471 g/mol
- Category
- Organic Bases
- Last updated
- 8/21/2026
No offers for this compound yet.
Request a quoteFrequently Asked Questions
What is the CAS number of Low molecular weight polyamide 650?
The CAS number of Low molecular weight polyamide 650 is 63428-84-2.
What are the molecular formula and molecular weight of Low molecular weight polyamide 650?
Low molecular weight polyamide 650 has molecular formula C23H26N2O4 and molecular weight 394.471 g/mol.
Data compiled from public chemical databases and supplier catalogs; supplier offers are provided by suppliers.
Last updated:
How to cite: Jingsj. "Low molecular weight polyamide 650 (CAS 63428-84-2)". Jingsj Chemical Database. https://www.jingsj.com/compound/J-1417585-1 (accessed 2026-10-26).
Data for reference only; verify specifications, grades and regulatory status with suppliers before purchase.