|
项目 分析纯
(AR)
含量(Cu)Assay,% ≥ 99.5
硝酸不溶物Insoluble matter,% ≤ 0.01
硫化氢沉淀物Snbstances not prec-
ipitated by hydrogen sulfide,% ≤ 0.04
铁(Fe)Iron,% ≤ 0.01
砷(As)Arsenic,% ≤ 0.001
银(Ag)silver,% ≤ 0.002
锑和锡(以Sn计)Antimony and tin,% ≤ 0.01
铅(Pb)Lead,% ≤ 0.01
4N,99.99%
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤100 ppm
纯度Purity(metal basis) ≥99.99 %
99.9%，D50(0.2～0.55μm)
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤1000 ppm
纯度Purity(metal basis) ≥99.9 %
平均粒度Particle size, D50 0.2 - 0.55 μm
99.9%，D50(0.6～1.0μm)
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤1000 ppm
纯度Purity(metal basis) ≥99.9 %
平均粒度Particle size, D50 0.6～1.0μm
99.9%，D50(1.0～3.0μm)
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤1000 ppm
纯度Purity(metal basis) ≥99.9 %
平均粒度Particle size, D50 1.0～3.0μm
99.9%，10-30nm
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤1000 ppm
纯度Purity(metal basis) ≥99.9 %
平均粒度Particle size 10-30nm
99.9%，80-100nm
外观Appearance Copper-colored powder
X射线衍射X-ray diffraction Conforms to standard
纯度Purity (complexometric titration) 98-102 %
ICP Assay Confirms copper component
痕量金属Trace analysis, ICP ≤1000 ppm
纯度Purity(metal basis) ≥99.9 %
平均粒度Particle size 80-100nm
|