REACH / TSCA compliant marketplace

Molecular structure of C21H23ClFNO2

Epoxy resins

CAS No.: 61788-97-4
Molecular Formula: C₂₁H₂₃ClFNO₂
IUPAC Name: Epoxy resins
MDL Number
Molecular Weight: 375.864 g/mol
Category

Physicochemical Properties

Boiling Point	529.0±50.0 °C at 760 mmHg
Density	1.2±0.1 g/cm3
Flash Point	273.8±30.1 °C

GHS Safety & Compliance

Signal word: